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Fabless Semiconductor Association Announces Six Percent Price Increase for 0.13-Micron Process Technology
FSA Releases Back-End Pricing Survey Results In
"Q1 2004 Wafer Fabrication & Test Assembly/Test Report"
SAN JOSE, Calif.—(BUSINESS WIRE)—April 21, 2004—
The Fabless Semiconductor Association (FSA), a premier
semiconductor trade association, today announced the results of its
quarterly "Wafer Fabrication and Assembly/Test Pricing Survey,"
analyzing the average price paid per wafer by 129 fabless companies
and integrated device manufacturers (IDMs). The "Q1 2004 Wafer
Fabrication & Assembly/Test Report" indicates that average prices for
wafers using 0.13-micron process geometry increased six percent from
Q3 2003 to Q1 2004.
The majority of participants ordered 0.18-micron process geometry,
with more than 27 percent of fabless participants and 22 percent of
IDMs ordering wafers using this process geometry. Additionally, in Q1
2004, 12 percent of fabless wafer orders included 0.13-micron process
geometry, compared to 10 percent of all IDM orders placed for the same
process.
The survey results provide detailed insight into average unit
wafer costs (150mm, 200mm and 300mm) using factors such as process
geometry, number of metal layers, wafer process, number of poly layers
and epitaxial/non-epitaxial processes.
A new section was added to the survey this quarter to specifically
address assembly and test issues. Participant responses indicate that
fabless companies, on average, pay more for outsourced back-end
services than IDMs. Fabless companies pay 36 percent more than IDMs
for assembly services when including package family, leads and units
per week. Test service prices are 59 percent higher for fabless
companies than IDMs when test segment, signal pin count, digital data
rate and units per week are evaluated.
To ensure confidentiality, data was collected and tabulated by
Ernst & Young LLP, using a weighted industry average approach. Access
to detailed survey results can be purchased via the FSA Web site at
www.fsa.org/store.
About the Fabless Semiconductor Association:
The FSA is the global voice of fabless and hybrid semiconductor
companies and their foundry and supply chain partners. Incorporated in
1994, the Association (www.fsa.org) is focused on the perpetuation of
the fabless business model throughout the worldwide semiconductor
industry. The organization encourages the relationship between
semiconductor companies and suppliers; facilitates business
partnerships; creates awareness of the fabless/outsourced business
model; disseminates industry data; and fosters standards and policies.
FSA members include fabless companies, integrated device
manufacturers (IDMs), foundry providers, packaging/assembly houses,
intellectual property providers, electronic design automation
companies, OEMs, photomask companies, design software companies,
investment bankers, venture capitalists and other companies. FSA
members represent more than 21 countries spanning North America,
Asia-Pacific, Europe and the Middle East.
Contact:
Fabless Semiconductor Association
Vivian Pangburn, 972-866-7579 ext.140
vpangburn@fsa.org
or
Shelton PR
Media Contact
Helen Garrett / Erin Anthony, 972-239-5119 ext. 201 / 135
hgarrett@sheltongroup.com
eanthony@sheltongroup.com
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